Our DLI systems have been designed to offer the widest process versatility
These machines can perform different types of processes inside the same chamber: DLI-CVD, DLI-ALD, DLI pulse pressure CVD. The two-inch machine can in addition run infrared assisted ALD and CVD, RTP, RTCVD and MOCVD processes.
The applications are:
The applications are:
- Simple and multi-metallic oxides (see application notes)
- Nitrides, metals, and alloys
- 2D and 3D materials
- III-V, wide band gap semiconductors
- Etc.
Example of deposited materials:
- Oxydes: BaO, Y2O3, Cr2O3, TiO2, Al2O3, HfO2, Li2O, SiO2, LIPON, Bi2O3, Co3O4, CuCrO2, SiO2, LiNbO3, LaNiO3, SiZrOx, SrTiO3, BaTiO3, MovCrwFexBiyOz
- 2D materials: Graphene, h-BN, TMDs (MoS2, WS2, etc.)
- Metals: Pt, Mo, W, Ru ….
- Nitrides: TiN, AlN
Advantages and drawbacks of Direct Liquid Injection, Vapor draw, bubbler